LED Crystal Film Screen process.LED Large Screen SMT Manufacturing Process

　　1. The production process of LED screen mounting involves the use of surface adhesive for wave soldering and reflow soldering. It is mainly used to fix components onto printed boards, and is generally distributed using dispensing or steel screen printing methods to maintain the position of components on printed circuit boards (PCBs) and ensure that components are not lost during transmission on the assembly line. After attaching the components, place them in an oven or reflow soldering machine for heating and hardening. It is different from the so-called solder paste. Once heated and hardened, it will not dissolve even when heated, which means that the heat hardening process of the surface mount adhesive is irreversible. The effectiveness of SMT patch adhesive may vary depending on the thermal curing conditions, the materials being connected, the equipment used, and the operating environment. When using, the selection of SMT adhesive should be based on the production process.

　　2. Most surface mount adhesives (SMA) used in PCB assembly for LED large screens are epoxy resins, although polypropylene is also used for special purposes. After the introduction of high-speed adhesive systems and the mastery of how to handle products with relatively short shelf life in the electronics industry, epoxy resin has become a more mainstream adhesive technology worldwide. LED electronic display screen epoxy resin generally provides good adhesion to a wide range of circuit boards and has excellent electrical performance. The main components are: base material (i.e. main high molecular weight material), filler, curing agent, other additives, etc.

　　3. The purpose of using LED display screen mounting adhesive is a. to prevent component detachment during wave soldering (wave soldering process) b. to prevent component detachment on the other side during reflow soldering (double-sided reflow soldering process) c. to prevent component displacement and standing (reflow soldering process, pre coating process) d. to make markings (wave soldering, reflow soldering, pre coating). When batch changes are made to printed boards and components, the mounting adhesive is used for marking.

　　4. Classification of usage methods for LED large screen mounting adhesive a. Gluing type: It is applied on the printed circuit board through a dispensing device. b. Scraping type: Apply glue by printing and scraping with steel or copper mesh.

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