source:other news release time:2023-09-08 Hits: Popular:led screen wholesaler
1、 MB chip
Definition: Metal Bonding chip; This chip is a patented product of UEC.
Features: 1. Adopting high heat dissipation coefficient material - SI as the substrate, easy to dissipate heat.
2. Joining the epitaxial layer and substrate through a metal layer, while reflecting photons to avoid substrate absorption.
3. The conductive SI substrate replaces the GAAS substrate and has good thermal conductivity (thermal conductivity difference of 3-4 times), making it more suitable for high driving current fields.
4. Bottom metal reflective layer, beneficial for improving brightness and heat dissipation
5. Can be enlarged in size, suitable for the HIGH POWER field, ER: 42MIL MB
2、 GB chip
Definition: GLUE BONDING chip; This chip belongs to UEC's patented product
Features: 1. The transparent sapphire substrate replaces the light absorbing GAAS substrate, and its output power is more than twice that of traditional AS (ABSORBLE STRUCTURE) chips. The sapphire substrate is similar to the GAP substrate of TS chips.
2. The chip emits light on all sides and has excellent PATTERN performance
3. In terms of brightness, its overall brightness has exceeded the level of TS chip (8.6mil)
4. The dual electrode structure and its resistance to high temperature current are slightly inferior to TS single electrode chips
3、 TS chip
Definition: Transparent structure chip, which belongs to HP's patented product.
Features: 1. The chip manufacturing process is complex and far superior to AS LED
2. Excellent reliability
3. Transparent GAP substrate, non absorbing light, high brightness
4、 AS chip
Definition: ABSORBABLE cture chip
Features: 1. Quad chips, prepared using MOVFE process, and brightness items that are brighter than conventional chips
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