LED process flow

　　a) Cleaning: Ultrasonic cleaning is used to clean PCB or LED bracket and dry it.

　　b) Mounting: The electrode at the bottom of LED tube core (large wafer) is prepared with silver glue for expansion, and the expanded tube core (large wafer) is placed on the piercing platform. Under the microscope, the tube core is installed one by one on the corresponding solder plate of PCB or LED bracket with the piercing pen, and then the silver glue is solidified by sintering.

　　c) Pressure welding: use aluminum wire or gold wire welder to connect the electrode to the LED tube core for current injection lead. LED mounted directly on the PCB, generally using aluminum wire welder. (Gold wire welder is needed to make white TOP-LED)

　　d) Encapsulation: the LED tube core and welding wire are protected by epoxy through dispensing. On the PCB board, there are strict requirements for the shape of the solidified colloid, which is directly related to the brightness of the finished product of the back light source. This process will also take on the task of lighting phosphors (white leds).

　　e) Welding: If the backlight source is SMD-LED or other packaged LED, the LED needs to be welded to the PCB board prior to the assembly process.

　　f) film cutting: punch die cutting backlight required by various diffusion film, reflective film, etc.

　　g) Assembly: According to the requirements of the drawings, the various materials of the back light source shall be manually installed in the correct position.

　　h) Test: Check whether the photoelectric parameters of the backlight source and the uniformity of light output are good.

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