LED display heat dissipation method

　　1, air fluid mechanics, the use of lamp shell shape, to produce convective air, which is the lowest cost to strengthen the heat dissipation way.

　　2, thermal conductive plastic shell, plastic shell injection filled with thermal conductive material, increase the thermal conductivity of plastic shell, heat dissipation ability.

　　3, aluminum fin, this is the most common way of heat dissipation, aluminum fin as part of the shell to increase the heat dissipation area.

　　4, surface radiation heat treatment, the surface of the lamp shell radiation heat treatment, simple is to apply radiation heat dissipation paint, the heat can be radiated away from the surface of the lamp shell.

　　5, heat conduction tube heat dissipation, the use of heat conduction tube technology, the heat from the LED full-color display chip to the shell heat dissipation fin. In large lamps such as street lamps are common designs.

　　6, fan heat dissipation, lamp housing with longevity and high efficiency fan to strengthen heat dissipation, this method is low cost, good effect. However, the fan is cumbersome to change and not suitable for outdoor use, which is relatively rare.

　　7. Liquid bulb, using liquid bulb packaging technology, the transparent liquid with high thermal conductivity is filled into the bulb of the lamp body. This is currently in addition to the reflective principle, the only use of LED chip surface heat conduction, heat dissipation technology.

　　8, the use of heat integration of thermal conductivity, high thermal conductivity of ceramic, the purpose of the lamp shell heat dissipation is to reduce the working temperature of LED full-color display chip, due to the LED chip we often metal thermal conductivity, thermal expansion coefficient and material expansion coefficient difference, LED chip can not be welded directly, in order to avoid the high and low temperature thermal stress damage LED full-color display chip. The latest high thermal conductivity ceramic material has a thermal conductivity close to that of aluminum, and the expansion system can be adjusted to synchronize with the LED full-color display chip. In this way, heat conduction and heat dissipation can be integrated to reduce the intermediate process of heat conduction.

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