SMDLED reliability.P5 indoor LED module

　　The system thermal resistance of traditional SMD packaging applications is: chip solid crystal adhesive solder joint solder paste copper foil insulation layer aluminum material, while the system thermal resistance of COB packaging is: chip solid crystal adhesive aluminum material. Obviously, the system thermal resistance of COB packaging is much lower than that of traditional SMD packaging, which greatly improves the lifespan of LEDs.

　　In addition, the OREDA COB dispensing chip is directly fixed on the PCB board, resulting in a large heat dissipation area, which makes it difficult for the chip junction temperature to rise, resulting in better light attenuation and stable product quality; The SMD chip is fixed in a bowl, not in direct contact with the PCB board, resulting in a small heat dissipation area, which directly leads to poor heat dissipation performance, leading to an increase in chip junction temperature and greater light attenuation. And these reasons are precisely the bottlenecks in the development of SMD full color technology.

　　Waterproof, moisture-proof, and UV resistant

　　COB performs well in terms of waterproofing, moisture-proof, and UV protection when applied outdoors due to the use of adhesive on the board to form a lens. However, SMD generally uses a bracket made of PPA material, which is poor in waterproofing, moisture-proof, and UV protection. If the problems in waterproofing and moisture-proof are not solved properly, it is easy to encounter quality problems such as failure, dimming, and rapid attenuation.

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