P5 led screen module.Is the LED industry heading towards MIP or COB?

　　In the LED industry, while the market has increasingly high requirements for micro spacing, it is driving the continuous optimization of front-end technology. MiP and COB are two highly regarded technological routes and also the future development direction of LED. So should the LED industry move towards MiP or COB?

　　Discussion 1: What are MiP and COB technologies?

　　MIP, also known as Mini/Micro LED in Package, is an integrated packaging technology. Firstly, a large amount of Micro LED chips are transferred onto the carrier board on the epitaxial chip, and then directly packaged and cut into single or multiple integrated small chips. Then, the small chips are divided into light and mixed, and then the mounting process and screen surface coating are carried out to complete the production of the display screen.

　　COB, also known as Chip on Board, is a technology that directly binds LED chips to a circuit board. A new packaging method different from SMD surface mount packaging technology is to adhere the bare chip to the PCB with conductive or non-conductive adhesive, then perform wire bonding to achieve its electrical connection, and use adhesive to encapsulate the chip and bonding leads.

　　Discussion 2: Who dominates the ups and downs in the trend of ultra-high definition display

　　The advantages of MIP lie in its flexibility and cost-effectiveness. Due to the ability of MIP packaging technology to meet product applications with different point spacing, it has a wider range of applications, including commercial displays, consumer electronics, and automotive displays. At the same time, MIP packaging technology can use current machine equipment for production, thereby reducing the high investment of enterprises in production line equipment.

　　The advantage of COB lies in its high reliability and stability. COB packaging technology integrates LED chips onto a substrate, achieving electrical connection and protection through on-board chip packaging, thus possessing advantages such as higher reliability, stability, and convenient maintenance. Meanwhile, COB packaging technology can achieve high integration, integrating multiple LED chips together to achieve higher performance indicators such as brightness, contrast, and color reproduction.

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